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Tamale B.

Product Design Engineer | Mechanical & Enclosure Design Specialist & PCB Design Engineer

Kampala, Uganda

Global rank:

13,388 / 125,149

Skill pts: 5

2D & 3D Modeling Solidworks 4years Autodesk Fusion 360 latest version with 3.5years of experience Industrial Design Product Concept Development Prototyping

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About

I am a Product Design Engineer specializing in the development of complex electro-mechanical products, transforming ideas into manufacturable, real-world solutions. Since January 2024, I have focused on designing durable, user-centric products for high-traffic and demanding environments, with particular expertise in enclosure design for consumer electronics and IoT devices.

My work combines aesthetic industrial design with rigorous engineering principles to create products that are visually appealing, structurally robust, and optimized for manufacturing. I specialize in designing enclosures and housings for both sheet metal fabrication and injection-molded plastics, ensuring sensitive electronics are protected while maintaining an intuitive and refined user experience.

I enjoy solving challenging design problems that require a deep understanding of materials, thermal management, structural integrity, and efficient assembly. From custom kiosks and handheld devices to RF systems and embedded electronics hardware, I bridge the gap between electronic engineering and physical product design.

My deliverables typically include complete, manufacturing-ready CAD packages with clear documentation to support prototyping, production, and scaling.

Experience

PRODUCT DESIGN ENGINEER ARAKNERD · Full-time Jan 2024 – Present 2 yrs 2 mos Uganda Experience
CAD Designer & Product Design Engineer
BuzzTime SmartBooth | January 2024 – Present

Project Overview:
Led the complete mechanical and enclosure design for the BuzzTime SmartBooth, a rugged communication kiosk for students in boarding schools. This project involved designing a secure, durable, and user-friendly housing for a complex electronic system, bridging the gap between industrial design and mass manufacturing.

Key Responsibilities & Achievements:

Full Enclosure Design: Engineered a dual-material enclosure system consisting of a tamper-resistant outer sheet metal body and a precision-molded hinged internal plastic housing to protect internal electronics and withstand constant use in high-traffic school environments.

Integration & Fit: Designed the internal layout and mounting points to accommodate a MediaTek Helio P22T processor board, power supply, and display, ensuring proper fit, thermal management, and serviceability.

User Interface Design: Integrated RFID-enabled ID card and wristband readers into the enclosure, designing a seamless user interaction point for secure student logins.

Design for Manufacturing (DFM): Developed the design with mass production in mind, selecting materials and manufacturing processes (sheet metal forming and plastic injection molding) suitable for a product with a production price range of $10,000+.

Deliverables: Created detailed 3D models, assembly drawings, and a comprehensive CAD package ready for prototyping and vendor quoting.

Cross-Functional Collaboration: Worked closely with electrical engineers and software developers (responsible for the parent app and admin tools) to ensure the physical design met all technical and user requirements.

Education

Kyambogo University Bachelor of Engineering in Mechanical and Manufacturing Engineering, Mechanical Engineering / Product Design, Second Class Upper 2020 – 2024 Activities and Societies: Kyambogo University Mechanical Engineering Student's Association (KYUMESA) - Active member, participating in engineering workshops and networking events with industry professionals. Hands-on Lab Training - Practical experience in specialized labs using CNC machines, internal combustion engines, and simulation software including ANSYS for FEA and thermal analysis. Engineering Society - Member of the broader Faculty of Engineering society, collaborating on multidisciplinary projects and technical exhibitions. Industry Engagement - Participated in internships and industry visits facilitated through department partnerships with the Uganda Manufacturing Association (UMA) and NEMA. Pursued a comprehensive "hands-on, minds-on" engineering education within the Department of Mechanical and Production Engineering at Kyambogo University's Faculty of Engineering. This programme combines theoretical foundations with extensive practical application, preparing graduates for real-world engineering challenges.

Core Curriculum Highlights:
Mechanical system design and analysis
Manufacturing processes and production engineering
Thermodynamics and fluid mechanics
Automotive and power systems engineering
Industrial engineering and management principles

Technical Skills Developed:
Simulation & Analysis: Proficient use of ANSYS for finite element analysis (FEA), thermal simulation, and structural optimization of mechanical components and assemblies.

Manufacturing Knowledge: Hands-on experience with CNC machines, understanding of machining processes, and exposure to modern manufacturing techniques.

Engineering Fundamentals: Strong foundation in mechanics, materials science, and production engineering principles that inform every CAD design decision.

Project Work:
Applied engineering principles to design projects that required integrating mechanical systems with practical manufacturing constraints, developing skills in:

Design for Manufacturing (DFM)
Material selection for specific applications
Technical documentation and engineering drawings
System integration and assembly considerations

The programme's emphasis on practical lab work--including access to specialized facilities for refrigeration, air conditioning, and advanced manufacturing--has instilled a disciplined approach to engineering design that prioritizes functionality, manufacturability, and real-world performance.

Other experience

PCB designers & electrical schematics Successfully delivered a complex, high-performance 18-layer multilayer PCB for an advanced RF system operating in the 17.7GHz – 34GHz range. The project involved designing for strict signal integrity and high-frequency reliability using industry-leading software and standards.

Project Scope & Specifications:
Board Complexity: 18-Layer Multilayer PCB.
Component Count: Managed a dense layout of 500+ components.
Key Components: Integrated specialized RF ICs including the F6932 (Dual-Channel Low Noise Amplifier) and F6122 (Dual-beam Rx Active Beamforming IC).

Software Used: Altium Designer.

Deliverables & Expertise Provided:
Stack-up Design: Engineered a controlled impedance stack-up optimized for high-frequency performance (utilizing materials like Megtron 6 equivalents).

Signal Integrity: Applied RF design best practices and via structure review to ensure signal integrity and minimize loss.

Schematic & Layout: Created full schematic diagrams and oversaw the component placement and routing for the 18-layer board.

DFM/DFA Validation: Performed a comprehensive Design for Manufacturing (DFM) and Design for Assembly (DFA) check to ensure the board was fabrication-ready, eliminating the need for complex back-drilling where possible.

Documentation Package: Delivered a complete manufacturing package including:

Fabrication-Ready Gerber Files and NC Drill data.

Detailed Bill of Materials (BOM).

Comprehensive Fabrication Notes.

Source files for future modifications.

Client Communication: Maintained transparent communication regarding the supply chain for specialized RF components (advising on sourcing for Renesas parts) and coordinated timeline adjustments to ensure a quality delivery.