Tamale B.
Global rank:
14,591 / 139,796
Skill pts: 5

About

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Experience

  • PRODUCT DESIGN ENGINEER ARAKNERD · Full-time Jan 2024 – Present 2 yrs 6 mos Uganda Experience
    CAD Designer & Product Design Engineer
    BuzzTime SmartBooth | January 2024 – Present

    Project Overview:
    Led the complete mechanical and enclosure design for the BuzzTime SmartBooth, a rugged communication kiosk for students in boarding schools. This project involved designing a secure, durable, and user-friendly housing for a complex electronic system, bridging the gap between industrial design and mass manufacturing.

    Key Responsibilities & Achievements:

    Full Enclosure Design: Engineered a dual-material enclosure system consisting of a tamper-resistant outer sheet metal body and a precision-molded hinged internal plastic housing to protect internal electronics and withstand constant use in high-traffic school environments.

    Integration & Fit: Designed the internal layout and mounting points to accommodate a MediaTek Helio P22T processor board, power supply, and display, ensuring proper fit, thermal management, and serviceability.

    User Interface Design: Integrated RFID-enabled ID card and wristband readers into the enclosure, designing a seamless user interaction point for secure student logins.

    Design for Manufacturing (DFM): Developed the design with mass production in mind, selecting materials and manufacturing processes (sheet metal forming and plastic injection molding) suitable for a product with a production price range of $10,000+.

    Deliverables: Created detailed 3D models, assembly drawings, and a comprehensive CAD package ready for prototyping and vendor quoting.

    Cross-Functional Collaboration: Worked closely with electrical engineers and software developers (responsible for the parent app and admin tools) to ensure the physical design met all technical and user requirements.

Education

  • KAIST Bachelor of Science in Electrical Engineering and Mechatronics systems and control, Mechatronics Engineering / Systems and Control, Second Class Upper 2020 – 2023 Activities and Societies: KAIST Robotics Club – Participated in robotics design projects, technical workshops, and collaborative engineering competitions. Systems and Control Laboratory – Gained hands-on experience in control systems, embedded systems, robotics, and automation through laboratory research and practical projects. Mechatronics Engineering Society – Engaged in seminars, technical talks, and multidisciplinary engineering projects with students and faculty. Industry and Research Engagement – Participated in research collaborations, innovation programs, and industry networking events with leading Korean technology companies and research institutes. Pursued a comprehensive education in Electrical Engineering with a specialization in Mechatronics Systems and Control at the Korea Advanced Institute of Science and Technology (KAIST). The program combined advanced theoretical knowledge with research-oriented and hands-on learning, equipping students to solve complex engineering challenges in automation, robotics, embedded systems, and intelligent control.

    Core Curriculum Highlights:

    Control systems engineering and system dynamics
    Robotics and mechatronic system design
    Embedded systems and microcontroller applications
    Signal processing and electronic circuit design
    Artificial intelligence and autonomous systems

    Technical Skills Developed:

    Designed and implemented embedded systems using microcontrollers and sensors.
    Developed control algorithms for robotic and mechatronic applications using MATLAB/Simulink and Python.
    Applied simulation and modeling techniques for dynamic systems, control optimization, and system performance analysis.
    Gained practical experience with automation systems, real-time control, and hardware-software integration.

    Project Work:
    Applied engineering principles to multidisciplinary projects involving intelligent systems, robotics, and automation, developing expertise in:

    Embedded system design and programming
    Sensor integration and data acquisition
    Control algorithm development and system optimization
    PCB design, prototyping, and hardware validation
    Technical documentation and engineering project management

    The program emphasized innovation, interdisciplinary collaboration, and research-driven engineering, providing a strong foundation in modern mechatronics, automation, and intelligent control systems while preparing graduates for advanced engineering and technology development.

Other experience

  • PCB designers & electrical schematics Successfully delivered a complex, high-performance 18-layer multilayer PCB for an advanced RF system operating in the 17.7GHz – 34GHz range. The project involved designing for strict signal integrity and high-frequency reliability using industry-leading software and standards.

    Project Scope & Specifications:
    Board Complexity: 18-Layer Multilayer PCB.
    Component Count: Managed a dense layout of 500+ components.
    Key Components: Integrated specialized RF ICs including the F6932 (Dual-Channel Low Noise Amplifier) and F6122 (Dual-beam Rx Active Beamforming IC).

    Software Used: Altium Designer.

    Deliverables & Expertise Provided:
    Stack-up Design: Engineered a controlled impedance stack-up optimized for high-frequency performance (utilizing materials like Megtron 6 equivalents).

    Signal Integrity: Applied RF design best practices and via structure review to ensure signal integrity and minimize loss.

    Schematic & Layout: Created full schematic diagrams and oversaw the component placement and routing for the 18-layer board.

    DFM/DFA Validation: Performed a comprehensive Design for Manufacturing (DFM) and Design for Assembly (DFA) check to ensure the board was fabrication-ready, eliminating the need for complex back-drilling where possible.

    Documentation Package: Delivered a complete manufacturing package including:

    Fabrication-Ready Gerber Files and NC Drill data.

    Detailed Bill of Materials (BOM).

    Comprehensive Fabrication Notes.

    Source files for future modifications.

    Client Communication: Maintained transparent communication regarding the supply chain for specialized RF components (advising on sourcing for Renesas parts) and coordinated timeline adjustments to ensure a quality delivery.