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Skill pts: 10
#3D Design Modeling 2D & 3D Engineering Design 2D & 3D Mechanical Design 3D Modeling & Product Design CAD Design

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Portfolio

Experience

  • - Semiconductor Module Assembly — Tool Mobility & Tipping Analysis Problem HCL TECHNOLOGIES · Full-time Jan 2026 – Present 0 mos Hyderabad, TS, India - Heavy module with mobility and tipping risk during transport.
    Solution: Redesigned module sub‑assembly in NX; performed tipping analysis per SEMI; optimized center‑of‑gravity and mounting points.
    Tools & Deliverables: NX assembly; CG calculations; 2D manufacturing drawings; build support notes; cost reduction estimate.

Education

  • Osmania University Masters of Engineering, Mechanical, null 2016 – 2018 Activities and Societies: null

Other experience

  • GD&T & First Article Inspection Package • Problem: Inconsistent inspection results causing rework and delays.
    • Solution: Created GD&T‑compliant drawings, tolerance stack‑up analysis, and standardized FAI templates.
    • Deliverables: ASME‑standard drawings, tolerance analysis report, inspection sheet template.
  • 3D‑Printed Prototype Series for Consumer Product - Problem: Need for rapid prototyping with functional features and printability constraints.
    - Solution: Designed print‑ready CAD parts, optimized wall thickness, added snap‑fit features, validated fit with iterative prints.
    - Deliverables: STL files, CAD models, prototype photos, additive manufacturing notes.

Licenses & Certifications

  • Solid Works DESAULT SYSTEMS Feb 2017 – Present