Global rank:
5,506 / 75,066
Skill pts: 5
3D Modeling and Assemblies Autodesk Inventor 2018 CAD Design Computation Fluid Dynamics Electronic Enclosure Design Electronics Cooling Electronics Packaging Finite Element Analysis Pro/ENGINEER Creo 2018 Quick-Turn Prototyping Simulation SolidWorks 2022 SolidWorks Flow Simulation 2022 Thermal Analysis Thermal Systems Engineering Thermodynamic Analysis


Innovative Thermal Engineer specializing in electronics cooling and electronics packaging. A 7+ year veteran of SolidWorks, including SolidWorks Simulate and SolidWorks Flow Simulation. Through detailed simulation, I bring deep analytic insight to the thermal design space and take the guesswork out of electronics cooling.

I have experience designing:

- Machined enclosures/heatsinks optimized for natural convection
- Machined enclosures/heatsinks with embedded cooling fans
- Sheetmetal chassis with cooling fans (rack mount and freestanding)
- Complex heat pipe systems
- Liquid-cooled coldplates
- High-power RF enclosures and shielding


  • Thermal Engineer Triad RF Systems · Full-time Apr 2020 – Present 3 yrs 10 mos East Brunswick, NJ, United States
  • Thermal-Mechanical Engineer Reno Subsystems Inc. · Full-time Jun 2016 – Apr 2020 3 yrs 10 mos Sparks, NV, United States


  • Rowan University Bachelor of Science, Mechanical Engineering 2012 – 2016 Activities and Societies: Men's Lacrosse