Ajay K.
I am professional design engineer and thermal analysis.
Bengaluru,
India
About
2.Thermal analysis on module level , board level and system level on ansys icepak
3.Good in Creo 3.0 part modeling, sheet metal, assembly, mechanism, animation, cabling,molding Tool
4.Structural analysis
5.Design of SFF and LFF bracket and chassis assembly As per OCP 3.0 specification(Broadcom)
6.EMN/EMP creation in Creo for sharing it to ECAD Team & EMN/EMP verification.
7.plastic design, Good understanding of Plastic materials, B-side features creation used for Automotive trims
applications
8.Fair Knowledge in fundamentals of sheet metal working and also on the design calculations
and consideration
9.Experienced in understanding tooling feasibility studies, concept developments for sheet metal
and plastic product development
10.Preparing mechanism and animation in creo parametric for better understanding of the
concept.
Experience
-
mechanical design engineer
tessolve semiconductor pvt.ltd · Full-time
May 2016 –
Present
9 yrs 7 mos
Bengaluru, KA, India
I have experience of 4 years
good in design engineer and thermal simulation
mechanism and animation in creo
handled Broadcom projects
supporting for PCB design team as mechanical engineer
creation of emn emp file
Education
- Vishveshwarayya Technical university Belagavi M.tech, Machine design, Distinction 2014 – 2016 Activities and Societies: cricket songs involved in structural and thermal analysis projects
Other experience
-
Teaching CAD Softwears
worked as a mechanical assistant professor
Teaching Cad software
0 followers, 0 following
Joined: July 8, 2020
Languages
Kannada Native or bilingual proficiency
Telugu Native or bilingual proficiency
English Professional working proficiency
Hindi Limited working proficiency
Location
Bengaluru, India