Global rank:
32,463 / 58,340
Skill pts: 0
Hire / Invite to Project


1. 2D to 3D conversion

2.Thermal analysis on module level , board level and system level on ansys icepak

3.Good in Creo 3.0 part modeling, sheet metal, assembly, mechanism, animation, cabling,molding Tool

4.Structural analysis

5.Design of SFF and LFF bracket and chassis assembly As per OCP 3.0 specification(Broadcom)

6.EMN/EMP creation in Creo for sharing it to ECAD Team & EMN/EMP verification.

7.plastic design, Good understanding of Plastic materials, B-side features creation used for Automotive trims

8.Fair Knowledge in fundamentals of sheet metal working and also on the design calculations
and consideration

9.Experienced in understanding tooling feasibility studies, concept developments for sheet metal
and plastic product development

10.Preparing mechanism and animation in creo parametric for better understanding of the

3D Models


  • mechanical design engineer tessolve semiconductor · Full-time May 2016 – Present 6 yrs 10 mos Bengaluru, KA, India I have experience of 4 years
    good in design engineer and thermal simulation
    mechanism and animation in creo
    handled Broadcom projects
    supporting for PCB design team as mechanical engineer
    creation of emn emp file


  • Vishveshwarayya Technical university Belagavi, Machine design, Distinction 2014 – 2016 Activities and Societies: cricket songs involved in structural and thermal analysis projects

Other experience

  • Teaching CAD Softwears worked as a mechanical assistant professor

    Teaching Cad software