Bohdan C.
Electronic Engineer | PCB Design | Embedded Systems | IoT Expert
Nosivka,
Ukraine
Global rank:
16,304
/
139,628
Skill pts: 5
About
✅ 100% Client Satisfaction
✅ Top Embedded and Firmware developer
✅ Top Hardware designer
✅ Top Software design
✅ Top Mechanical design and industrial design
✅ Top Enclosure design
Services:
1) Hardware/Electronics design (Power, Analog, Digital/High-speed and RF electronics design)
2) Precertification testing (EMI, ESD, EMC, FCC, CE, UL)
3) Firmware design С/C++ (Bare metal MCU/MPU, FreeRTOS, Zephyr RTOS, Embedded Linux, Wireless protocols, Security, Interfaces, etc)
4) Industrial and Mechanical design (Enclosure design, 3D printing, IP standards, Prepare all for injection molding, etc)
5) UX/UI design (Embedded devices with displays, Mobile and Desktop applications)
6) Software design (Android, IOS, Linux kernel and user space development)
7) Embedded Quality Assurance(QA) and testing
8) Manual verification/testing PCB/FPC, functional and unit testing of the Firmware/Software, stress testing, temperature range testing
Service->Hardware design service:
- Power electronics design: (PFC, Solar charging controller, chargers, high voltage control, Motor controllers DC/AC/BLDC )
- Analog electronics design: High-accuracy analog measurements, Noise filtration, Digital to analog conversion, Amplifying signal
- Digital and high-speed electronics design: - Memories DDRx/LPDDRx, SDRAM, Camera and display interfaces (MIPI-DSI, MIPI-CSI, DisplayPort, etc), Data communication interfaces (QSpi, SPI, UART, I2C, FMC, I2S, USB 2/3.x, etc), (
- RF Designs: ( 50-60 GHz (Radars), 1-6 GHz (UWB, Wifi, BLE, ZigBee, GPS, NB-IoT, LTE-M/LTE, Z-Wave, etc), 13,6 MHz, 128 kHz (NFC, RFID, etc), 433 MHz (Custom protocols)
Service->Industrial and Mechanical design
- Industrial design of the sketch - it includes a few sketch designs, depending on the physical sizes of the device, specific of industry and user experience
- Mechnical CAD design with deep PCB integration - it includes full mechanical draw based on the industrial design with detailed sizes, materials and manufacturing specific.
- Thermal calculation and simulation - it includes simulation of the heating device inside enclosure, with theoretical cooling calculation
- 3D printing and verification - we use 3D printer hp jet fusion 5210, with a very nice quality of printing, that helps us to make a good verification of parts with PCBs
- Injection molding - the last step, which includes manufacturing optimization and making pres forms, preparing documentation for the manufacturing
Service->Firmware design С/C++:
- Languages: C/C++, Assembler
- Diagrams: Block, UML, Workflow, APIs
- Interfaces: I2S, SAI, MIPI-DSI, MIPI-CSI, USB 2/3.x, LTDC, DDR3/DDR4/LPDDR4, I2C, SPI/QSPI, UART, CAN, Ethernet
- Wireless: NB-IoT, LTE M, GPRS, GPS, LTE, UWB, WiFi, BLE, ZigBee, Z-Wave, LoRa, Thread, 6LoWPAN, Sub 1GHz, NFC (13,6 MHz), RFID 433 MHZ and 128 kHz
- Protocols : MQTT, HTTP, FTP, Modbus TCP/RTU, SNMP, TCP/IP, UDP/IP, DLMS, custom protocols
- Security: AES, SSL/TLS, custom algorithms
- Libs and frameworks: TouchGFX (GUI lib for MCU), emWin (GUI lib for MCU), LVGL (GUI lib for MCU), WolfSSL (SSL/TLS), Mbed TLS(SSL/TLS), osxMotionFX (Sensors fusion algorithm based on the Kalman theory), FatFS, lwIP (TCP/IP stack), WICED (Wifi stack), aws/amazon-freertos, Paho MQTT, TensorFlow
- Embedded OS: FreeRTOS, TI-RTOS, ZephyrOs, Embedded Linux, Yocto, ROS
- MCUs: NXP (i.MX RT1064, LPC1100, LPC4000), Nordic (NRF52xx/NRF53xx/NRF91xx), TI (CC3220/CC26xx/CC1100/CC3200, MSP430), Espressif (esp32, esp8266), ST(STM32H7/F7/F4/L4/F0/L0/WB/WL/G0 and STM8), Atmel/Microchip(SAM D20/D21/L21/R21/V70/V71, SAMA5/SAM4/SAMD4), Silicon Labs(EFR32, ZGM130S), Cypress (PSoC 3/PSoC 4), Kinetis (Family MK81FN256VDC15), Holtek (HT68xx)
- MPUs: Analog Devices (ADSP-2156x SHARC), Qualcomm (Snapdragon 625/425/610/845), Allwinner (A64, A33, H3, H6 series), NXP (I.MX6/I.MX7/I.M8) , ST(STM32MP1)
- SOMs: NVIDIA Jetson nano, NVIDIA Jetson Orin Nano, NVIDIA Jetson AGX Orin, Toradex (Colibri iMX6, IMX7, IMX8), Raspberry pi (CM3, CM4 modules), Inforce (Qualcomm Snapdragon 410, 820, 845 SOM), 8devices (Mango on Qualcomm IPQ6000/IPQ6010 Soc), Sensiedge(SensiBle 1 and 2, SensiLora)
Service->Software:
- Languages: Java, Kotlin, C#, C/C++, Python, Java Script
- Diagrams: Block, UML, Workflow, APIs
- Interfaces: USB, Ethernet
- Protocols : MQTT, HTTP, FTP, Modbus TCP/RTU, SNMP, TCP/IP, UDP/IP, DLMS, custom protocols
- Wireless: BLE, WiFi, UWB
- Security: AES, SSL/TLS
- Libs and frameworks: GStreamer, Paho MQTT, WolfSSL (SSL/TLS), Mbed TLS(SSL/TLS), QT framework, Xamarin Forms and Maui, ASP .NET Core and web development, React (web UI development), SQLite DB, FireBase DB, Mong DB, InfuxDB DB, Room, TensorFlow, Node.js
- OS: Android, IOS, Linux, Windows
... more »
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✅ Top Embedded and Firmware developer
✅ Top Hardware designer
✅ Top Software design
✅ Top Mechanical design and industrial design
✅ Top Enclosure design
Services:
1) Hardware/Electronics design (Power, Analog, Digital/High-speed and RF electronics design)
2) Precertification testing (EMI, ESD, EMC, FCC, CE, UL)
3) Firmware design С/C++ (Bare metal MCU/MPU, FreeRTOS, Zephyr RTOS, Embedded Linux, Wireless protocols, Security, Interfaces, etc)
4) Industrial and Mechanical design (Enclosure design, 3D printing, IP standards, Prepare all for injection molding, etc)
5) UX/UI design (Embedded devices with displays, Mobile and Desktop applications)
6) Software design (Android, IOS, Linux kernel and user space development)
7) Embedded Quality Assurance(QA) and testing
8) Manual verification/testing PCB/FPC, functional and unit testing of the Firmware/Software, stress testing, temperature range testing
Service->Hardware design service:
- Power electronics design: (PFC, Solar charging controller, chargers, high voltage control, Motor controllers DC/AC/BLDC )
- Analog electronics design: High-accuracy analog measurements, Noise filtration, Digital to analog conversion, Amplifying signal
- Digital and high-speed electronics design: - Memories DDRx/LPDDRx, SDRAM, Camera and display interfaces (MIPI-DSI, MIPI-CSI, DisplayPort, etc), Data communication interfaces (QSpi, SPI, UART, I2C, FMC, I2S, USB 2/3.x, etc), (
- RF Designs: ( 50-60 GHz (Radars), 1-6 GHz (UWB, Wifi, BLE, ZigBee, GPS, NB-IoT, LTE-M/LTE, Z-Wave, etc), 13,6 MHz, 128 kHz (NFC, RFID, etc), 433 MHz (Custom protocols)
Service->Industrial and Mechanical design
- Industrial design of the sketch - it includes a few sketch designs, depending on the physical sizes of the device, specific of industry and user experience
- Mechnical CAD design with deep PCB integration - it includes full mechanical draw based on the industrial design with detailed sizes, materials and manufacturing specific.
- Thermal calculation and simulation - it includes simulation of the heating device inside enclosure, with theoretical cooling calculation
- 3D printing and verification - we use 3D printer hp jet fusion 5210, with a very nice quality of printing, that helps us to make a good verification of parts with PCBs
- Injection molding - the last step, which includes manufacturing optimization and making pres forms, preparing documentation for the manufacturing
Service->Firmware design С/C++:
- Languages: C/C++, Assembler
- Diagrams: Block, UML, Workflow, APIs
- Interfaces: I2S, SAI, MIPI-DSI, MIPI-CSI, USB 2/3.x, LTDC, DDR3/DDR4/LPDDR4, I2C, SPI/QSPI, UART, CAN, Ethernet
- Wireless: NB-IoT, LTE M, GPRS, GPS, LTE, UWB, WiFi, BLE, ZigBee, Z-Wave, LoRa, Thread, 6LoWPAN, Sub 1GHz, NFC (13,6 MHz), RFID 433 MHZ and 128 kHz
- Protocols : MQTT, HTTP, FTP, Modbus TCP/RTU, SNMP, TCP/IP, UDP/IP, DLMS, custom protocols
- Security: AES, SSL/TLS, custom algorithms
- Libs and frameworks: TouchGFX (GUI lib for MCU), emWin (GUI lib for MCU), LVGL (GUI lib for MCU), WolfSSL (SSL/TLS), Mbed TLS(SSL/TLS), osxMotionFX (Sensors fusion algorithm based on the Kalman theory), FatFS, lwIP (TCP/IP stack), WICED (Wifi stack), aws/amazon-freertos, Paho MQTT, TensorFlow
- Embedded OS: FreeRTOS, TI-RTOS, ZephyrOs, Embedded Linux, Yocto, ROS
- MCUs: NXP (i.MX RT1064, LPC1100, LPC4000), Nordic (NRF52xx/NRF53xx/NRF91xx), TI (CC3220/CC26xx/CC1100/CC3200, MSP430), Espressif (esp32, esp8266), ST(STM32H7/F7/F4/L4/F0/L0/WB/WL/G0 and STM8), Atmel/Microchip(SAM D20/D21/L21/R21/V70/V71, SAMA5/SAM4/SAMD4), Silicon Labs(EFR32, ZGM130S), Cypress (PSoC 3/PSoC 4), Kinetis (Family MK81FN256VDC15), Holtek (HT68xx)
- MPUs: Analog Devices (ADSP-2156x SHARC), Qualcomm (Snapdragon 625/425/610/845), Allwinner (A64, A33, H3, H6 series), NXP (I.MX6/I.MX7/I.M8) , ST(STM32MP1)
- SOMs: NVIDIA Jetson nano, NVIDIA Jetson Orin Nano, NVIDIA Jetson AGX Orin, Toradex (Colibri iMX6, IMX7, IMX8), Raspberry pi (CM3, CM4 modules), Inforce (Qualcomm Snapdragon 410, 820, 845 SOM), 8devices (Mango on Qualcomm IPQ6000/IPQ6010 Soc), Sensiedge(SensiBle 1 and 2, SensiLora)
Service->Software:
- Languages: Java, Kotlin, C#, C/C++, Python, Java Script
- Diagrams: Block, UML, Workflow, APIs
- Interfaces: USB, Ethernet
- Protocols : MQTT, HTTP, FTP, Modbus TCP/RTU, SNMP, TCP/IP, UDP/IP, DLMS, custom protocols
- Wireless: BLE, WiFi, UWB
- Security: AES, SSL/TLS
- Libs and frameworks: GStreamer, Paho MQTT, WolfSSL (SSL/TLS), Mbed TLS(SSL/TLS), QT framework, Xamarin Forms and Maui, ASP .NET Core and web development, React (web UI development), SQLite DB, FireBase DB, Mong DB, InfuxDB DB, Room, TensorFlow, Node.js
- OS: Android, IOS, Linux, Windows
Experience
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Junior Electronic Integration Technician
GlobalLogic · Full-time
Dec 2023 –
May 2026
2 yrs 5 mos
Kyiv, Kyiv city, Ukraine
After successfully completing during six month internship, I joined GlobalLogic to further strengthen my practical engineering expertise and gain hands-on industrial experience in advanced electronics engineering, embedded systems, and real world product development.
As an Embedded Systems and Electronics Engineer at GlobalLogic, I possess practical experience in IoT devices, PCB verification, embedded hardware design, and firmware integration. I am proficient in STM32 and ARM based microcontrollers, embedded C/C++, and communication protocols such as UART, SPI, I2C and CAN. I have outstanding capabilities in hardware debugging, circuit analysis, and the development of industrial and smart electronic systems. I have experience collaborating with international, multi functional engineering teams to provide reliable embedded and IoT solutions for global projects. -
Electronic Integration Technician
Ajax Design Firm · Full-time
May 2023 –
Nov 2023
6 mos
Kyiv, Kyiv city, Ukraine
After graduating from Chernihiv State Technological University, I joined Ajax Systems to strengthen my practical engineering expertise and gain professional industry experience in Electronic Engineering.
During my 6 months training and internship program, I worked extensively on embedded systems, electronic hardware development, PCB design and testing, as well as hardware debugging and technical troubleshooting.
This experience allowed me to enhance my hands on engineering skills, improve my solving abilities of problems, and gain valuable exposure to real world electronic and embedded system development projects.
Education
- Chernihiv State Technological University M E, Electro-electronics, 5 2018 – 2023
Other experience
- Software and Technical Tools Experience Highly experienced with a broad range of industry standard software and engineering tools, including PCB design platforms such as Altium Designer, KiCad , and Eagle CAD, simulation and analysis tools including LTspice, Proteus, and MATLAB/Simulink , embedded development environments such as STM32CubeIDE, PlatformIO , Arduino IDE, and Visual Studio Code, along with version control systems like Git and GitHub to support efficient collaboration, code management, and streamlined project development.
Stats
0 followers, 0 following
Age: 25
Joined: May 21, 2026
Last seen: July 20, 2026
Area of Expertise
Languages
Ukrainian Native or bilingual proficiency
English Full professional proficiency
Location
Nosivka, Chernihivs'ka Oblast', Ukraine