Daniele F.
PhD. Physics, 15 years experience in semiconductor packaging design and reliability. Embedded, solde
Italy
Global rank:
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Electronic Packaging
MATLAB Simulink
Mosfet
Physical Modeling
Physical Modelling Synthesis
Experience
- CTO / Owner / Founder Finarmodule sagl · Self-employed Sep 2016 – Present 9 yrs 10 mos Switzerland Radical innovation in power electronics materials. Material micro structuring. Leadframe, attach interaction. Thermal performance and extreme reliability.
Education
- Politechnic university of Milano Ph. D., Physic, Merit 2001 – 2004 Activities and Societies: Formula SAE
- University Pavia laurea in ingegneria, Electronic & Electrical Engineering 1994 – 2000 Activities and Societies: Associazione ATA CAD Lab Power Electronics Lab
Stats
0 followers, 0 following
Joined: March 20, 2025
Last seen: June 11, 2025
Area of Expertise
Gadgets Design
DIY Design
Engineering Design
Structural Engineering
New Invention Development
Electronic Devices
Patent Search
Patent FAQs
Pet Product Design
Reverse Engineering
FEA Finite Element Analysis
Prototype Design Engineering
Computational Fluid Dynamics
Product Engineering Services
Design for Assembly Services
Electronic Enclosures Design
Electronics Design Service
Electrical and Electronic Engineers Professional Staffing
Languages
English Full professional proficiency
Chinese (Simplified) Elementary proficiency
Italian Native or bilingual proficiency
Location
Italy