3D Model
Enclosure for mosfet module
Enclosure for mosfet module
3D Model
Protection Circuit - Power Electronics
Designed and simulated a high-current MOSFET protection circuit in LTspice, featuring parallel MOSFET arrays, a 175A fuse, Zener-based gate protection, and capacitive filtering. Verified the circuit topology
3D Model
Bidirectional buck converter
Texas instruments on a custom designed control board. The type of valve used in the project is Si-Mosfet which can withstand high current (75A) per valve and 2 parallel valves structure, switching frequency
3D Model
Fuzzy-Logic Temperature Control for a Digital Viscometer (Peltier power stage)
heat or cool. POWER STAGE - THREE ITERATIONS The first version used an H-bridge with 4 N-channel MOSFETs and one device overheated. The second, with 2 N-channel and 2 P-channel devices, burned current traces
Job
3D Modeling & Simple PCB Design - Outdoor Sensor Prototype
integrate an ESP32-C3, SHT40 air sensor, LIS3DH accelerometer, and a basic subcircuit consisting of one MOSFET and two resistors.
Connectors: The PCB requires JST connectors for a 18650 battery and external
Designer
a_hannan92
PCB Design and Review Engineer | KiCad, ESP32, Embedded system and IOT
sections, creepage and clearance checks to IPC-2221 - Industrial interfaces: RS485, ADC/DAC, relay and MOSFET driver stages Recent projects: a 230 V relay and sensing board on a DIN rail, a 7-relay indoor control
Designer
djordjenatic
Electrical Engineer experienced in layout and PCB design
design up to 5 kW, switching frequencies up to 5 MHz • Battery systems: BMS, balancing, charging, MOSFET drivers PCB Design • Professional PCB layout using Altium Designer and KiCAD • High density, mixed
3D Model
DC-AC-BattConv-1K
kWh battery power inverter board — it takes DC from a battery pack and switches it through power MOSFETs into an isolated inverter stage to produce AC output
Job
PCB Layout
different communication protocols.
Special attention is needed for thermal management for driving MOSFETs, and clean routing for SPI/I2C signals and analog inputs from an external DAC (MCP4902) and to external
Designer
Daniele_F
PhD. Physics, 15 years experience in semiconductor packaging design and reliability. Embedded, solde