Ranjith V.

Experience

• PCB Deisgner HCL Technologies · Full-time Sep 2026 – Present 1 mos Chennai, Tamil Nadu, India Working as a PCB Design Engineer, specializing in Cadence Allegro PCB layout, high-speed routing, and multilayer board design. Experienced in DDR4/DDR5, PCIe, SATA, USB, Ethernet, HDI, and server and power boards. Responsible for component placement, constraint-driven routing, design rule verification, SI/PI considerations, DFM, and Gerber generation. Focused on delivering high-quality, manufacturable PCB layouts that meet project specifications.
• Senior Executive Design Solar Defence and Aerospace Ltd · Full-time Mar 2026 – Sep 2026 6 mos Hyderabad, Telangana, India Worked as a PCB Design Engineer at Solar Defence & Aerospace, specializing in multilayer and HDI PCB layout using Cadence Allegro. Experienced in component placement, high-speed routing, DDR, USB, Ethernet, RS422/RS485, and CAN interfaces. Responsible for constraint-driven routing, design rule checks, SI/PI considerations, design verification, and Gerber generation, ensuring compliance with electrical, mechanical, and manufacturing requirements.
• Senior Engineer VVDN Technologies · Full-time Jul 2024 – Mar 2026 1 yrs 8 mos Chennai, Tamil Nadu, India Worked as a PCB Design Engineer at VVDN Technologies, specializing in server and power distribution board design using Cadence Allegro. Experienced in multilayer PCB design up to 16 layers, high-speed routing for DDR4/DDR5, PCIe, and SATA interfaces, and high-current power boards up to 400A. Responsibilities included component placement, constraint-driven routing, SI/PI considerations, design rule verification, DFM checks, and Gerber generation, ensuring high-quality and manufacturable PCB designs.
• Associate Engineer L&T Technologies and Services · Full-time Jun 2021 – Jun 2024 3 yrs Chennai, Tamil Nadu, India Worked as a PCB Design Engineer at L&T Technology Services, specializing in PCB layout and routing for automotive BMS, LED lighting, and electronic test systems. Experienced in multilayer PCB design up to 12 layers, high-speed interface routing, and designs using blind and buried vias. Responsibilities included component placement, routing optimization, design rule checks, SI/PI considerations, EMI/EMC support, DFM, and Gerber generation, ensuring reliable and manufacturable PCB designs.