Siddharth B.
Mechanical CAD & FEA Engineer | 3D Modeling, Stress & Thermal Analysis
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About
I am a CAD and FEA Engineer specializing in 3D mechanical design, structural analysis, and design validation for real-world applications. I help transform concepts into manufacturable, mechanically reliable designs backed by simulation, not assumptions.
My expertise includes parametric 3D modeling, assemblies, tolerance-aware design, and engineering drawings, along with Finite Element Analysis (FEA) for stress, deformation, factor of safety, and thermal behavior. I focus on identifying weak points early, optimizing geometry, and reducing material or weight without compromising strength.
I have experience working with static structural, modal, and thermal simulations, applying proper boundary conditions, realistic loads, and material properties. I do not treat FEA as a “color plot exercise” — results are always interpreted, validated, and translated into actionable design changes.
If you need accurate CAD models, simulation-backed decisions, or design optimization before manufacturing, I can support your project from concept to validated design.
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My expertise includes parametric 3D modeling, assemblies, tolerance-aware design, and engineering drawings, along with Finite Element Analysis (FEA) for stress, deformation, factor of safety, and thermal behavior. I focus on identifying weak points early, optimizing geometry, and reducing material or weight without compromising strength.
I have experience working with static structural, modal, and thermal simulations, applying proper boundary conditions, realistic loads, and material properties. I do not treat FEA as a “color plot exercise” — results are always interpreted, validated, and translated into actionable design changes.
If you need accurate CAD models, simulation-backed decisions, or design optimization before manufacturing, I can support your project from concept to validated design.
Experience
-
Embedded system and IOT Intern
FieldByte PVT LTD · Internship
Jun 2025 –
Sep 2025
3 mos
Kolkata, WB, India
Developed and deployed firmware for the Agritech project.
• Designed and prototyped mechanical/electronic assemblies.
• Implemented RS485 Modbus RTU communication.
• Configured STM32 firmware for low-latency performance.
• Performed testing and quality control. -
Research intern
IIT Roorkee · Internship
Dec 2024 –
Aug 2025
8 mos
Kolkata, WB, India
Project: Smart Public Transport Tracking System
• Collaborated with IIT Roorkee faculty on bus tracking
prototype.
• Integrated GPS + cellular connectivity for cloud updates.
• Developed cloud data pipelines + mobile app support.
• Contributed to testing, documentation, deployment
Education
- RCC Institute of Information Technology B.tech, ELECTRONICS 2022 – 2026
Stats
0 followers, 0 following
Joined: December 14, 2025
Last seen: January 13, 2026
Area of Expertise
3D Printing Design
Industrial Design Services
Concept Design
New Invention Development
Electronic Devices
Furniture Design
Wearables Design
Drone Design
PDF to DWG Conversion
Internet of Things (IoT)
FEA Finite Element Analysis
SolidWorks Engineering Services
3D Architectural Modeling
Exercise Equipment Design
Mechanical CAD Design
3D CAD Translation Services
3D Product Demo
Product Engineering Services
Design for Assembly Services
Firmware Developers
Languages
English Full professional proficiency
Hindi Full professional proficiency
Bengali (Bangla) Native or bilingual proficiency
Location
Kolkata, India