Global rank:
2,513 / 115,215
Skill pts: 12
AMD Xilinx Vivado corel draw High-Speed PCB Design Hyperlynx MPLAB X

About

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Experience

  • Embedded Hardware and Firmware Engineer Dalian Shiliang Techmoloty Co., Ltd · Full-time Feb 2014 – Jul 2025 11 yrs 5 mos Dalian, Liaoning, China I have over 10+ years of experience in embedded device development, specializing in hardware design, firmware integration, and high-speed signal processing.
    Throughout my career, I have successfully completed every project with high quality and reliability, delivering optimized embedded solutions that meet strict performance and safety standards.
    My work covers a wide range of processors, communication protocols, memory interfaces, and sensor systems applied in industrial, IoT, and medical devices.

Education

  • Dalian Maritime University Bachelor's Degree, Computer Science, 4 1996 – 2000

Other experience

  • Senior Electronic Engineer/PCB Design Engineer Dalianshiliang Science and Technology Co., Ltd. | Jan 2014 - Jun 2024
    With over a decade of dedicated experience at Xiliang Science and Technology, I have honed my expertise as a proficient and innovative PCB Development Engineer. My role encompassed the entire product development lifecycle, from conceptual design to mass production, ensuring the highest standards of quality and reliability.

    Key Responsibilities & Achievements:

    End-to-End PCB Development: Spearheaded the complete design and development process for complex, high-density interconnect (HDI) PCBs, including schematic capture, multi-layer stack-up design, and rigorous DFM/DFA analysis.

    Advanced Circuit Design: Engineered robust and efficient analog, digital, and mixed-signal circuit boards tailored for a diverse range of industrial and consumer electronics applications.

    Prototyping & Validation: Led the prototyping, testing, and validation phases, utilizing advanced equipment to identify and resolve issues, thereby reducing time-to-market and enhancing product performance.

    Cross-Functional Collaboration: Collaborated seamlessly with firmware, mechanical, and production teams to optimize board layout for signal integrity, thermal management, and manufacturability.

    Technical Leadership: Provided technical guidance and mentorship to junior engineers, fostering a culture of continuous improvement and excellence within the engineering department.