3D Model
Design and analysis of Cartesian 3D printer
mechanical design, I conducted a Finite Element Analysis (FEA) on the hotend extruder to evaluate its thermal behavior during operation. The analysis focused on determining the temperature distribution and heat
Job
Product Design Engineer for BESS products in the 261 kWh and 562 kWh
etc.).
Perform DC and AC system sizing, short-circuit calculations, protection coordination, and thermal calculations.
Mechanical Design
Develop GA drawings, assembly drawings, and 3D models using AutoCAD
Blog Post
What to Consider in Developing the Enclosure Design of Your Company’s Electronic Products
impact resistance, flexibility in design, and cost-effectiveness. However, considerations around thermal management and electromagnetic interference (EMI) shielding must be addressed when using plastics. Metals
Designer
LasseFrederiksen
Danish Mechanical Design Engineer | High-Fidelity CFD & DEM | 5-Axis Precision & Zero-Error Prototyp
(Computational Fluid Dynamics) and DEM (Discrete Element Method) using Altair HyperWorks. Specialized in thermal management for US Defense HVAC and abrasive wear optimization for mining equipment. Precision Execution:
Designer
Mushabbar_Noor
Aero-Mechanical Engineer with Computational Fluid Dynamics Expertise
Engineer, researching the thermal analysis and management of un-conditioned avionics systems. Specifically, I am using the Design of Experiment technique to evaluate the thermal behavior of avionics systems
Designer
siddhantb
Mechanical Design Engineer | SolidWorks Expert | Product Design | Injection Molding | Heat Sink | Sh
my career, I have worked on: • Plastic Injection Molded Enclosures • Sheet Metal Products • Thermal Management Components • Heat Sink Design • PCB Enclosures • Acrylic Prototypes • Testing Jigs & Fixtures
Service
I will create a PCB design for your startup with Altium and KiCad
validation.
• Professional PCB Layout
Multi-layer routing with attention to signal integrity, thermal management, impedance control, and optimized component placement.
• High-Speed & RF PCB Design
Specialized
3D Model
Nvidia Jetson Orin Nano Enclosure: Thermal Optimized & DFM Ready | Md Mamun Mia
# Thermal Optimized Enclosure for Nvidia Jetson Orin Nano ## Project Overview This project showcases the advanced **CAD design** and **DFM optimization** of a robust housing for the **Nvidia Jetson Orin
Designer
abhishekm009
Senior PCB & Signal Integrity Engineer with 15+ years in High-Speed, Power and Post Silicon Validati
hardware issues during testing. Power Electronics: Expertise in routing high-current traces, thermal management, and designing robust power delivery networks. I am proficient in professional-grade tools
Job
CAD Engineer – Portable Power‑Bank Design (Nexer)
(enclosure, mechanical components, thermal features)
Produce manufacturing‑ready CAD files and a complete BOM
Support prototype build & testing (fit, form, function, thermal performance, charge‑rate validation)