Compact ESP32 + SIMCom A7670E LTE PCB Design (Edge-Mounted I/O for Enclosure) Anyone

About the job

We need a compact ESP32 + SIMCom LTE (A7670E/G) baseboard designed for integration inside an enclosure.
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.

Key requirements:

MCU: ESP32-WROOM-32E (SMD)

Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)

Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)

Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32

Connectors (edge-mounted):

Top edge → MMCX antenna connector (for modem)

Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot

Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)

Design style: Fully SMD; only barrel jack (optional THT) if needed

Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge

Deliverables:

Complete KiCad or Altium design files (schematic + layout)

Gerbers and BOM ready for JLCPCB/PCBWay fabrication

Basic 3D step model / panel DXF for enclosure fit

Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.

Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SM... read more
We need a compact ESP32 + SIMCom LTE (A7670E/G) baseboard designed for integration inside an enclosure.
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.

Key requirements:

MCU: ESP32-WROOM-32E (SMD)

Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)

Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)

Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32

Connectors (edge-mounted):

Top edge → MMCX antenna connector (for modem)

Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot

Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)

Design style: Fully SMD; only barrel jack (optional THT) if needed

Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge

Deliverables:

Complete KiCad or Altium design files (schematic + layout)

Gerbers and BOM ready for JLCPCB/PCBWay fabrication

Basic 3D step model / panel DXF for enclosure fit

Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.

Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SMD manufacturing constraints. read less
We need a compact ESP32 + SIMCom LTE (A7670E/G) baseboard designed for integration inside an enclosure.
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.

Key requirements:

MCU: ESP32-WROOM-32E (SMD)

Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)

Input Power: 5 V – 28 V... read more
We need a compact ESP32 + SIMCom LTE (A7670E/G) baseboard designed for integration inside an enclosure.
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.

Key requirements:

MCU: ESP32-WROOM-32E (SMD)

Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)

Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)

Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32

Connectors (edge-mounted):

Top edge → MMCX antenna connector (for modem)

Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot

Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)

Design style: Fully SMD; only barrel jack (optional THT) if needed

Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge

Deliverables:

Complete KiCad or Altium design files (schematic + layout)

Gerbers and BOM ready for JLCPCB/PCBWay fabrication

Basic 3D step model / panel DXF for enclosure fit

Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.

Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SMD manufacturing constraints. read less

Things to know

Job location

Remote

Work location

Job skill level

Any

Skill Level

Job rate

Open budget

Fixed-rate

Job type

Part-time

Job type

Job length

Under 1-month

Job duration

Areas of expertise

Altium ESP32 Gerber PCB Design Files PCB Design PCB Manufacturing Power Supply Design +3 more

Job categories

Electronic Devices Electrical Engineering PCB Design Services

About the client

Payment not ready

India (09:34 pm)

Posted

Active

Job activity

8 Applicants

0 interviews in progress

3 unanswered invites

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