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Compact ESP32 + SIMCom A7670E LTE PCB Design (Edge-Mounted I/O for Enclosure) Ended
About the job
We need a compact ESP32 + SIMCom LTE (A7670E/G) baseboard designed for integration inside an enclosure.
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.
Key requirements:
MCU: ESP32-WROOM-32E (SMD)
Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)
Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)
Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32
Connectors (edge-mounted):
Top edge → MMCX antenna connector (for modem)
Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot
Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)
Design style: Fully SMD; only barrel jack (optional THT) if needed
Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge
Deliverables:
Complete KiCad or Altium design files (schematic + layout)
Gerbers and BOM ready for JLCPCB/PCBWay fabrication
Basic 3D step model / panel DXF for enclosure fit
Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.
Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SM... read more
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.
Key requirements:
MCU: ESP32-WROOM-32E (SMD)
Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)
Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)
Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32
Connectors (edge-mounted):
Top edge → MMCX antenna connector (for modem)
Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot
Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)
Design style: Fully SMD; only barrel jack (optional THT) if needed
Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge
Deliverables:
Complete KiCad or Altium design files (schematic + layout)
Gerbers and BOM ready for JLCPCB/PCBWay fabrication
Basic 3D step model / panel DXF for enclosure fit
Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.
Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SM... read more
We need a compact ESP32 + SIMCom LTE (A7670E/G) baseboard designed for integration inside an enclosure.
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.
Key requirements:
MCU: ESP32-WROOM-32E (SMD)
Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)
Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)
Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32
Connectors (edge-mounted):
Top edge → MMCX antenna connector (for modem)
Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot
Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)
Design style: Fully SMD; only barrel jack (optional THT) if needed
Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge
Deliverables:
Complete KiCad or Altium design files (schematic + layout)
Gerbers and BOM ready for JLCPCB/PCBWay fabrication
Basic 3D step model / panel DXF for enclosure fit
Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.
Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SMD manufacturing constraints. read less
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.
Key requirements:
MCU: ESP32-WROOM-32E (SMD)
Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)
Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)
Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32
Connectors (edge-mounted):
Top edge → MMCX antenna connector (for modem)
Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot
Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)
Design style: Fully SMD; only barrel jack (optional THT) if needed
Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge
Deliverables:
Complete KiCad or Altium design files (schematic + layout)
Gerbers and BOM ready for JLCPCB/PCBWay fabrication
Basic 3D step model / panel DXF for enclosure fit
Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.
Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SMD manufacturing constraints. read less
We need a compact ESP32 + SIMCom LTE (A7670E/G) baseboard designed for integration inside an enclosure.
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.
Key requirements:
MCU: ESP32-WROOM-32E (SMD)
Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)
Input Power: 5 V – 28 V... read more
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.
Key requirements:
MCU: ESP32-WROOM-32E (SMD)
Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)
Input Power: 5 V – 28 V... read more
We need a compact ESP32 + SIMCom LTE (A7670E/G) baseboard designed for integration inside an enclosure.
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.
Key requirements:
MCU: ESP32-WROOM-32E (SMD)
Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)
Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)
Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32
Connectors (edge-mounted):
Top edge → MMCX antenna connector (for modem)
Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot
Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)
Design style: Fully SMD; only barrel jack (optional THT) if needed
Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge
Deliverables:
Complete KiCad or Altium design files (schematic + layout)
Gerbers and BOM ready for JLCPCB/PCBWay fabrication
Basic 3D step model / panel DXF for enclosure fit
Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.
Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SMD manufacturing constraints. read less
The goal is to create a small, reliable PCB that provides LTE + GSM connectivity with proper power handling and neatly aligned connectors on specific edges.
Key requirements:
MCU: ESP32-WROOM-32E (SMD)
Modem: SIMCom A7670E or A7670G (LTE Cat-1 + GSM fallback)
Input Power: 5 V – 28 V DC, protected (reverse, surge, TVS, PTC)
Voltage Rails: 4.0 V @ 2.5 A for modem, 3.3 V @ 1.5 A for ESP32
Connectors (edge-mounted):
Top edge → MMCX antenna connector (for modem)
Left edge → Power port → JST-GH 4-pin (Pixhawk UART, 3.3 V) → Side-eject Nano-SIM slot
Form factor: ~50 × 35 mm, 4-layer stackup (L1 Signal/RF, L2 GND, L3 Power, L4 Signal)
Design style: Fully SMD; only barrel jack (optional THT) if needed
Includes: Level shifters (3.3 V↔1.8 V), ESD protection, bulk polymer caps for modem, test pads, mounting holes near I/O edge
Deliverables:
Complete KiCad or Altium design files (schematic + layout)
Gerbers and BOM ready for JLCPCB/PCBWay fabrication
Basic 3D step model / panel DXF for enclosure fit
Use case:
This PCB will serve as the communication core in a telemetry/tracking device. It must be reliable, small, and ready for enclosure integration with ports exposed at the panel.
Please include examples of previous ESP32/modem/RF board designs in your proposal. Preference for engineers experienced with RF layout, power design, and SMD manufacturing constraints. read less
Things to know
Any
Skill Level
Open budget
Fixed-rate
Part-time
Job type
Under 1-month
Job duration
Areas of expertise
Altium
ESP32
Gerber PCB Design Files
PCB Design
PCB Manufacturing
Power Supply Design
+3 more
Job categories
Electronic Devices
Electrical Engineering
PCB Design Services
About the client
Payment not ready
India (08:53 pm)
Posted
Active
Job activity
10 Applicants
0 interviews in progress
3 unanswered invites
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