Quantum Computing Hardware — 3D CAD & Mechanical Engineering Design Anyone

About the job

Quantum Computing Hardware — 3D CAD & Mechanical Engineering Design

Project Overview

I am looking for an experienced CAD designer / mechanical engineer to develop a professional 3D CAD model and engineering documentation for a quantum computing hardware concept.

The project involves the mechanical architecture and packaging of a quantum-computing system, including the enclosure, cryogenic/vacuum infrastructure, internal component mounting, shielding, cable routing, and assembly structure.

The quantum architecture and certain technical specifications will be provided separately and may require an NDA/confidentiality agreement before disclosure.

Scope of Work

The selected designer will be responsible for developing:

1. Complete 3D CAD assembly

- Main system enclosure
- Internal structural components
- Component mounting systems
- Service/access panels
- Cable and connector routing
- Mechanical interfaces

2. Cryogenic / vacuum mechanical architecture

- Cryogenic-stage mechanical structure
- Thermal-shield mounting
- Vacuum-compatible enclosure concepts
- Mechanical supports and interfaces
- Consideration of thermal contraction

3. Quantum-chip packaging

- Conceptual qubit-chip package
- Chip carrier/package housing
- Connector interfaces
- Mounting system
- RF/microwave cable interfaces

4. Shielding and isolation

- Magnetic-shielding enclosure concept
- Electr... read more
Quantum Computing Hardware — 3D CAD & Mechanical Engineering Design

Project Overview

I am looking for an experienced CAD designer / mechanical engineer to develop a professional 3D CAD model and engineering documentation for a quantum computing hardware concept.

The project involves the mechanical architecture and packaging of a quantum-computing system, including the enclosure, cryogenic/vacuum infrastructure, internal component mounting, shielding, cable routing, and assembly structure.

The quantum architecture and certain technical specifications will be provided separately and may require an NDA/confidentiality agreement before disclosure.

Scope of Work

The selected designer will be responsible for developing:

1. Complete 3D CAD assembly

- Main system enclosure
- Internal structural components
- Component mounting systems
- Service/access panels
- Cable and connector routing
- Mechanical interfaces

2. Cryogenic / vacuum mechanical architecture

- Cryogenic-stage mechanical structure
- Thermal-shield mounting
- Vacuum-compatible enclosure concepts
- Mechanical supports and interfaces
- Consideration of thermal contraction

3. Quantum-chip packaging

- Conceptual qubit-chip package
- Chip carrier/package housing
- Connector interfaces
- Mounting system
- RF/microwave cable interfaces

4. Shielding and isolation

- Magnetic-shielding enclosure concept
- Electromagnetic shielding
- Vibration-isolation provisions
- Thermal isolation

5. Engineering drawings

- Detailed manufacturing drawings
- Dimensions and tolerances
- Material specifications
- Assembly drawings
- Exploded views
- Bill of Materials (BOM)

Deliverables

Final deliverables should include:

- Native CAD files
- STEP files
- IGES files where applicable
- STL files where useful
- 2D manufacturing drawings in PDF/DWG/DXF
- Complete assembly
- Exploded assembly
- Bill of Materials
- Component list
- Recommended materials
- Basic mechanical tolerance specification

Preferred CAD Software

Experience with one or more of the following is preferred:

- SolidWorks
- Autodesk Fusion 360
- Siemens NX
- CATIA
- Creo
- Onshape

Please specify which CAD software you use.

Required Experience

The ideal candidate should have experience with several of the following:

- Precision mechanical engineering
- Cryogenic equipment
- Vacuum systems
- Scientific instrumentation
- RF/microwave hardware
- Semiconductor or chip packaging
- Electromagnetic shielding
- Thermal management
- Precision assemblies
- CNC/manufacturing design
- FEA/thermal simulation

Experience with quantum computing hardware, superconducting qubits, trapped-ion systems, or cryogenic quantum systems is a major advantage.

Engineering Requirements

The design should be developed with real-world manufacturability in mind.

The designer should consider:

- Thermal expansion/contraction
- Material compatibility
- Vacuum compatibility
- Mechanical tolerances
- Cable routing
- Serviceability
- Assembly/disassembly
- CNC machining
- Electrical isolation
- Thermal interfaces
- Vibration
- Electromagnetic interference

This is intended to be an engineering-grade concept, not simply a visual 3D model.

Confidentiality

Some project information is proprietary.

Before receiving sensitive technical information, the selected freelancer may be required to sign an NDA/confidentiality agreement.

Do not publicly disclose, reproduce, or distribute project information, drawings, specifications, or designs.

Application Requirements

Please provide:

1. Examples of relevant CAD projects.
2. Examples involving cryogenics, vacuum systems, scientific equipment, semiconductor packaging, or RF hardware if available.
3. Your CAD software and version.
4. Your engineering/manufacturing experience.
5. Estimated project timeline.
6. Fixed-price or hourly proposal.
7. Whether you can provide engineering drawings in addition to the 3D model.
8. Whether you can perform basic FEA/thermal analysis.
9. Whether you have experience designing components for CNC machining.

Important

Please do not submit generic architectural or consumer-product CAD portfolios.

Preference will be given to engineers/designers who can demonstrate experience with precision scientific, aerospace, semiconductor, cryogenic, vacuum, RF, or advanced computing hardware.

The project may be expanded into additional stages following successful completion of the initial CAD architecture.

Budget

Please submit your proposed budget based on the scope above.

The project can be divided into milestones, beginning with the conceptual mechanical architecture and progressing to detailed CAD and manufacturing documentation. read less
Quantum Computing Hardware — 3D CAD & Mechanical Engineering Design

Project Overview

I am looking for an experienced CAD designer / mechanical engineer to develop a professional 3D CAD model and engineering documentation for a quantum computing hardware concept.

The project involves the mechanical architecture and packaging of a quantum-computing system, including the enclosure, cryogenic... read more
Quantum Computing Hardware — 3D CAD & Mechanical Engineering Design

Project Overview

I am looking for an experienced CAD designer / mechanical engineer to develop a professional 3D CAD model and engineering documentation for a quantum computing hardware concept.

The project involves the mechanical architecture and packaging of a quantum-computing system, including the enclosure, cryogenic/vacuum infrastructure, internal component mounting, shielding, cable routing, and assembly structure.

The quantum architecture and certain technical specifications will be provided separately and may require an NDA/confidentiality agreement before disclosure.

Scope of Work

The selected designer will be responsible for developing:

1. Complete 3D CAD assembly

- Main system enclosure
- Internal structural components
- Component mounting systems
- Service/access panels
- Cable and connector routing
- Mechanical interfaces

2. Cryogenic / vacuum mechanical architecture

- Cryogenic-stage mechanical structure
- Thermal-shield mounting
- Vacuum-compatible enclosure concepts
- Mechanical supports and interfaces
- Consideration of thermal contraction

3. Quantum-chip packaging

- Conceptual qubit-chip package
- Chip carrier/package housing
- Connector interfaces
- Mounting system
- RF/microwave cable interfaces

4. Shielding and isolation

- Magnetic-shielding enclosure concept
- Electromagnetic shielding
- Vibration-isolation provisions
- Thermal isolation

5. Engineering drawings

- Detailed manufacturing drawings
- Dimensions and tolerances
- Material specifications
- Assembly drawings
- Exploded views
- Bill of Materials (BOM)

Deliverables

Final deliverables should include:

- Native CAD files
- STEP files
- IGES files where applicable
- STL files where useful
- 2D manufacturing drawings in PDF/DWG/DXF
- Complete assembly
- Exploded assembly
- Bill of Materials
- Component list
- Recommended materials
- Basic mechanical tolerance specification

Preferred CAD Software

Experience with one or more of the following is preferred:

- SolidWorks
- Autodesk Fusion 360
- Siemens NX
- CATIA
- Creo
- Onshape

Please specify which CAD software you use.

Required Experience

The ideal candidate should have experience with several of the following:

- Precision mechanical engineering
- Cryogenic equipment
- Vacuum systems
- Scientific instrumentation
- RF/microwave hardware
- Semiconductor or chip packaging
- Electromagnetic shielding
- Thermal management
- Precision assemblies
- CNC/manufacturing design
- FEA/thermal simulation

Experience with quantum computing hardware, superconducting qubits, trapped-ion systems, or cryogenic quantum systems is a major advantage.

Engineering Requirements

The design should be developed with real-world manufacturability in mind.

The designer should consider:

- Thermal expansion/contraction
- Material compatibility
- Vacuum compatibility
- Mechanical tolerances
- Cable routing
- Serviceability
- Assembly/disassembly
- CNC machining
- Electrical isolation
- Thermal interfaces
- Vibration
- Electromagnetic interference

This is intended to be an engineering-grade concept, not simply a visual 3D model.

Confidentiality

Some project information is proprietary.

Before receiving sensitive technical information, the selected freelancer may be required to sign an NDA/confidentiality agreement.

Do not publicly disclose, reproduce, or distribute project information, drawings, specifications, or designs.

Application Requirements

Please provide:

1. Examples of relevant CAD projects.
2. Examples involving cryogenics, vacuum systems, scientific equipment, semiconductor packaging, or RF hardware if available.
3. Your CAD software and version.
4. Your engineering/manufacturing experience.
5. Estimated project timeline.
6. Fixed-price or hourly proposal.
7. Whether you can provide engineering drawings in addition to the 3D model.
8. Whether you can perform basic FEA/thermal analysis.
9. Whether you have experience designing components for CNC machining.

Important

Please do not submit generic architectural or consumer-product CAD portfolios.

Preference will be given to engineers/designers who can demonstrate experience with precision scientific, aerospace, semiconductor, cryogenic, vacuum, RF, or advanced computing hardware.

The project may be expanded into additional stages following successful completion of the initial CAD architecture.

Budget

Please submit your proposed budget based on the scope above.

The project can be divided into milestones, beginning with the conceptual mechanical architecture and progressing to detailed CAD and manufacturing documentation. read less

Things to know

Job location

Remote

Work location

Job skill level

Any

Skill Level

Job rate

$100

Fixed-rate (USD)

Job type

Part-time

Job type

Job length

6+ months

Job duration

Areas of expertise

3D CAD Design 3D Design 3D Modeling Advanced Assembly Modeling Computer Aided Engineering Concept Design Prototyping +4 more

Job categories

Computer Hardware Engineers Staffing and Recruiting Computer Hardware Engineering Staffing Agency 3D Design Services

About the client

Payment not ready

Brazil (05:31 am)

Posted

Active

Job activity

9 Applicants

0 interviews in progress

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