Kiruthika S.

Experience

• IC substrate designer Caliber Interconnect solution · Full-time Sep 2021 – May 2025 3 yrs 8 mos Tirunelveli, TN, India Flip-chip and BGA Design: Lead the design and optimization of flip-chip BGA packages
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  with Lower pitch, higher die pin count, and multi-layer routing. Created complex
  multilayer organic substrates (MLO/MLC, coreless substrate) for high- density routing
  applications
  Signal Integrity and Power Integrity: Implemented advanced techniques for optimizing
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  signal integrity (SI) and power integrity (PI) in high-speed designs, including impedance
  matching, differential pair routing, and managing decoupling capacitors to minimize IR
  drop.
  High-Speed Interface Design: Worked extensively on high-speed interfaces such as PCIe,
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  DDR, USB, WLAN, LPDDR, MIPI, and RF. Optimized signal routing to meet stringent
  performance requirements and achieve reliable high-speed communication
  Collaborative Design: Coordinated with a cross-functional team of engineers to ensure
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  the seamless execution of design projects. Provided guidance and mentorship on best
  practices for substrate design, including layout recommendations for optimizing PDN
  and SI.
  Project Ownership: Took full ownership of design projects, managing all aspects of the
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  design process, including layout creation, constraints setup, and ensuring the design
  adhered to customer requirements and quality standards