Luis Alonso A.
Mechanical Engineer | CAE/FEA Specialist
Curridabat,
Costa Rica
Global rank:
12,940
/
131,673
Skill pts: 5
About
Mechanical Engineer with over 15 years of experience in CAE/FEA analysis, mechanical design, and structural simulation of high-reliability components and systems across power generation, aerospace, automotive, semiconductor, and medical device industries. Expertise includes developing baseline stress models, conducting structural, thermal, and dynamic analyses, and validating simulations against test data to support design optimization, performance enhancement, and repair strategies. Proficient in CAD tools (NX, SolidWorks, Inventor, AutoCAD) and advanced CAE platforms (ANSYS, Abaqus, Nastran, Simcenter 3D, ADINA, HyperMesh), with strong automation skills using Python and MAPDL. Experienced in prototype validation and cross-functional collaboration to deliver cost-effective, manufacturable solutions. Recognized for technical leadership, effective client engagement, and the ability to clearly communicate complex engineering insights to drive informed, data-driven decisions.
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Experience
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Senior Research and Development Engineer
Boston Scientific (Insight Global Contractor) · Full-time
May 2024 –
Aug 2025
1 yrs 3 mos
Costa Rica
• Led the evaluation of new product designs and refined existing technologies in medical devices.
• Prepared detailed reports and collaborated with cross-functional teams to optimize designs for safety and performance -
Senior Computational Simulation Engineer
Triz Engineering Solutions · Full-time
May 2024 –
Jul 2024
2 mos
Costa Rica
• Performed structural and fatigue analyses on commercial truck components for leading companies like Volvo and Freightliner.
• Utilized FEA software to simulate real-world loading conditions and optimize designs for strength, fatigue resistance, and safety.
• Delivered detailed simulation reports and recommendations for design improvements. -
FEA Structural Analyst
Intel · Full-time
Aug 2022 –
Aug 2023
1 yrs
Costa Rica
• Led structural analyses and FEA simulations on semiconductor packaging to predict and mitigate thermal warpage and mechanical stresses.
• Developed a new control method to model thermal expansion-driven package warpage, improving analysis accuracy and reducing process time by 75%.
• Performed risk assessments for heatsinks under combined thermal-mechanical loading.
Education
- University of Costa Rica Master, • Master’s Degree in Mechanical Engineering, null 2022 – 2026 Activities and Societies: null
Stats
0 followers, 0 following
Joined: January 21, 2026
Last seen: February 25, 2026
Location
Curridabat, Florida, Costa Rica