Sanskar V.

Experience

• Mechanical Design Engineer Makenica Pvt Ltd · Full-time Jan 2026 – Present 7 mos Bangalore, Karnataka, India Designed electromechanical and IoT enclosures from concept through prototype, production release, and end-use
  deployment with ingress protection features, applying DFM, DFA, and DfAM principles to optimise manufacturability,
  product reliability, and reduce design iteration count.
  Developed assembly fixtures and ophthalmic devices, performed design reviews, design verification, and conducted
  design validation through real-world functional testing.
  Executed Scan-to-CAD reverse engineering using 3D scanning and Geomagic Design X to generate ±0.2 mm accurate parametric CAD models, accelerating redesign and production-ready documentation.
• Junior Mechanical Engineer Arys Garage · Full-time Jul 2025 – Dec 2025 5 mos Bengaluru, KA, India Designed and executed virtual prototyping and multi-axis stiffness validation of a hybrid chromoly–aluminium trellis EV
  motorcycle chassis using SolidWorks and validated through Ansys Mechanical.
  Achieved high stiffness-to-weight efficiency, resulting in ~7.5 kN·m/deg torsional stiffness and stiffness to weight ratio of ~600 N·m/deg/kg at a 12.5 kg frame mass, comparable to cast-aluminium motorcycle frames.
  Executed conceptual virtual prototyping of a 3.67 kg lightweight rear swingarm in SolidWorks and ANSYS, leveraging stiffness-driven geometry and axle-level load abstraction to characterize torsional, lateral, and longitudinal compliance.
  Achieved ~1.39 kN·m/deg torsional rigidity, ~1.62 kN/mm lateral stiffness, and ~25.2 kN/mm longitudinal stiffness,
  delivering a high stiffness-to-weight rear structure aligned with performance-oriented EV motorcycle handling targets.
  Designed a 72 V architecture Li-ion battery pack of configuration 20s20p using 21700 cylindrical cells, packaged as five stacked modules within a structural battery enclosure to meet EV packaging constraints.
  Engineered custom cell holders and pack-level layouts, and developed preliminary busbar and nickel interconnect routing considering current distribution, mechanical stability, and thermal feasibility.