Remote
Work location
Industrial / Product Designer Needed for Electronic Sensor Enclosure (Injection Molded, IP Rated) Anyone
About the job
Industrial designer needed for rugged electronic sensor enclosure.
Design 2–3 concept options and final product look before mechanical engineering stage. Device contains PCB, battery, Bluetooth module. Must understand injection molding and IP-rated enclosure basics. Deliver renderings and surface 3D file (STEP/IGES). Experience in electronics enclosure design preferred. Timeline 2–4 weeks.
Design 2–3 concept options and final product look before mechanical engineering stage. Device contains PCB, battery, Bluetooth module. Must understand injection molding and IP-rated enclosure basics. Deliver renderings and surface 3D file (STEP/IGES). Experience in electronics enclosure design preferred. Timeline 2–4 weeks.
Industrial designer needed for rugged electronic sensor enclosure.
Design 2–3 concept options and final product look before mechanical engineering stage. Device contains PCB, battery, Bluetooth module. Must understand injection molding and IP-rated enclosure basics. Deliver renderings and surface 3D file (STEP/IGES). Experience in electronics enclosure design preferred. Timeline 2–4 weeks.
Design 2–3 concept options and final product look before mechanical engineering stage. Device contains PCB, battery, Bluetooth module. Must understand injection molding and IP-rated enclosure basics. Deliver renderings and surface 3D file (STEP/IGES). Experience in electronics enclosure design preferred. Timeline 2–4 weeks.
Industrial designer needed for rugged electronic sensor enclosure.
Design 2–3 concept options and final product look before mechanical engineering stage. Device contains PCB, battery, Bluetooth module. Must understand injection molding and IP-rated enclosure basics. Deliver renderings and surface 3D file (STEP/IGES). Experience in electronics enclosure design preferred. Timeline 2–4 weeks.
Design 2–3 concept options and final product look before mechanical engineering stage. Device contains PCB, battery, Bluetooth module. Must understand injection molding and IP-rated enclosure basics. Deliver renderings and surface 3D file (STEP/IGES). Experience in electronics enclosure design preferred. Timeline 2–4 weeks.
Industrial designer needed for rugged electronic sensor enclosure.
Design 2–3 concept options and final product look before mechanical engineering stage. Device contains PCB, battery, Bluetooth module. Must understand injection molding and IP-rated enclosure basics. Deliver renderings and surface 3D file (STEP/IGES). Experience in electronics enclosure design preferred. Timeline 2–4 weeks.
Design 2–3 concept options and final product look before mechanical engineering stage. Device contains PCB, battery, Bluetooth module. Must understand injection molding and IP-rated enclosure basics. Deliver renderings and surface 3D file (STEP/IGES). Experience in electronics enclosure design preferred. Timeline 2–4 weeks.
Things to know
Intermediate
Skill Level
Open budget
Hourly
Part-time
Job type
Under 1-month
Job duration
Areas of expertise
2D & 3D Mechanical MODELING
Job categories
3D Character Modeling Services
About the client
Payment ready
Saudi Arabia (02:33 am)
Posted
Active
Job activity
28 Applicants
3 interviews in progress
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