About the job
We are seeking a highly skilled CAD Engineer / Mechanical Designer to create a premium, functional, and manufacturing-ready enclosure for a custom portable electronics device (cyberdeck). The final deliverable must be a fully cohesive, watertight .STEP file optimized for both high-end 3D printing (FDM/SLA) and potential future injection molding.The project involves a multi-layered, compact handheld chassis featuring a folding display lid utilizing laptop-grade constant-torque friction hinges. This design requires strict tolerance management for internal components and internal cable routing.To ensure absolute design accuracy, I will provide the complete, detailed dimensional schematics and 3D footprints for all major hardware components, including:Single-board computer (Orange Pi 5 Max)AMOLED Display panel, bezel constraints, and its associated driver/controller boardMobile battery power bank (INIU 10,000mAh 45W)Ultra-compact wireless keyboard with trackpadInternal electronic modules (Dual buck converters, USB-C PD 140W trigger board, 4010 cooling fan, and latches)Key Responsibilities:Transform provided hardware schematics and a layout brief into a highly polished, functional dual-enclosure chassis (Middle_Frame/Screen Cover and Bottom_Tray/Base Unit).Implement precise internal drop-in retaining slots, custom component divider walls, and screw standoff pillars (M2/M3/M4 hardware clearances) to eliminate loose internal shifting.Engineer custom aesthetic features, including a s...
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We are seeking a highly skilled CAD Engineer / Mechanical Designer to create a premium, functional, and manufacturing-ready enclosure for a custom portable electronics device (cyberdeck). The final deliverable must be a fully cohesive, watertight .STEP file optimized for both high-end 3D printing (FDM/SLA) and potential future injection molding.The project involves a multi-layered, compact handheld chassis featuring a folding display lid utilizing laptop-grade constant-torque friction hinges. This design requires strict tolerance management for internal components and internal cable routing.To ensure absolute design accuracy, I will provide the complete, detailed dimensional schematics and 3D footprints for all major hardware components, including:Single-board computer (Orange Pi 5 Max)AMOLED Display panel, bezel constraints, and its associated driver/controller boardMobile battery power bank (INIU 10,000mAh 45W)Ultra-compact wireless keyboard with trackpadInternal electronic modules (Dual buck converters, USB-C PD 140W trigger board, 4010 cooling fan, and latches)Key Responsibilities:Transform provided hardware schematics and a layout brief into a highly polished, functional dual-enclosure chassis (Middle_Frame/Screen Cover and Bottom_Tray/Base Unit).Implement precise internal drop-in retaining slots, custom component divider walls, and screw standoff pillars (M2/M3/M4 hardware clearances) to eliminate loose internal shifting.Engineer custom aesthetic features, including a stylized ventilation/air intake grille optimized for a 4010 cooling fan.Optimize structural walls (targeting 2.8mm–3.0mm profiles) and draft angles to prevent structural sagging and ensure seamless physical mating between case layers.Requirements & Qualifications:Extensive experience in industrial product design and mechanical engineering for electronics enclosures.Absolute mastery of professional parametric CAD software (SolidWorks, Autodesk Inventor, Fusion 360, or FreeCAD) capable of exporting pristine, error-free .STEP and .IGES files.Deep understanding of 3D printing manufacturing tolerances, material shrinkage, and drop-seam concealed hinge geometry.Strong communication skills and attention to sub-millimeter precision.Work Arrangement & Budget:This contract will be handled strictly as a fixed-price budget contract. Milestone payouts will be released upon the verification of design phases and tolerance fit checks. The chosen candidate will work remotely and log their project progression transparently. **NOTE:: Attached are reference screenshots of my current layout concept, along with official manufacturer datasheets for the core hardware. I have already solved the internal component arrangement and hinge alignment strategy. Your job will be to take this exact layout layout blueprint, refine the structural wall tolerances, ensure perfect snapping fits between the layers, and export it into a unified, professional .STEP file.
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We are seeking a highly skilled CAD Engineer / Mechanical Designer to create a premium, functional, and manufacturing-ready enclosure for a custom portable electronics device (cyberdeck). The final deliverable must be a fully cohesive, watertight .STEP file optimized for both high-end 3D printing (FDM/SLA) and potential future injection molding.The project involves a multi-layered, compact handhel...
read more
We are seeking a highly skilled CAD Engineer / Mechanical Designer to create a premium, functional, and manufacturing-ready enclosure for a custom portable electronics device (cyberdeck). The final deliverable must be a fully cohesive, watertight .STEP file optimized for both high-end 3D printing (FDM/SLA) and potential future injection molding.The project involves a multi-layered, compact handheld chassis featuring a folding display lid utilizing laptop-grade constant-torque friction hinges. This design requires strict tolerance management for internal components and internal cable routing.To ensure absolute design accuracy, I will provide the complete, detailed dimensional schematics and 3D footprints for all major hardware components, including:Single-board computer (Orange Pi 5 Max)AMOLED Display panel, bezel constraints, and its associated driver/controller boardMobile battery power bank (INIU 10,000mAh 45W)Ultra-compact wireless keyboard with trackpadInternal electronic modules (Dual buck converters, USB-C PD 140W trigger board, 4010 cooling fan, and latches)Key Responsibilities:Transform provided hardware schematics and a layout brief into a highly polished, functional dual-enclosure chassis (Middle_Frame/Screen Cover and Bottom_Tray/Base Unit).Implement precise internal drop-in retaining slots, custom component divider walls, and screw standoff pillars (M2/M3/M4 hardware clearances) to eliminate loose internal shifting.Engineer custom aesthetic features, including a stylized ventilation/air intake grille optimized for a 4010 cooling fan.Optimize structural walls (targeting 2.8mm–3.0mm profiles) and draft angles to prevent structural sagging and ensure seamless physical mating between case layers.Requirements & Qualifications:Extensive experience in industrial product design and mechanical engineering for electronics enclosures.Absolute mastery of professional parametric CAD software (SolidWorks, Autodesk Inventor, Fusion 360, or FreeCAD) capable of exporting pristine, error-free .STEP and .IGES files.Deep understanding of 3D printing manufacturing tolerances, material shrinkage, and drop-seam concealed hinge geometry.Strong communication skills and attention to sub-millimeter precision.Work Arrangement & Budget:This contract will be handled strictly as a fixed-price budget contract. Milestone payouts will be released upon the verification of design phases and tolerance fit checks. The chosen candidate will work remotely and log their project progression transparently. **NOTE:: Attached are reference screenshots of my current layout concept, along with official manufacturer datasheets for the core hardware. I have already solved the internal component arrangement and hinge alignment strategy. Your job will be to take this exact layout layout blueprint, refine the structural wall tolerances, ensure perfect snapping fits between the layers, and export it into a unified, professional .STEP file.
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