Thermal Material Selection | SOLIDWORKS Analysis

Compared heat conduction and spreading in SOLIDWORKS through a conduction-bar benchmark, electronics bridge and layered saucepan. At 1 W input and a 25 C cooled end, bar peaks were 87.50 C for 304 stainless steel, 30.99 C for 6061-T6 aluminium and 27.56 C for copper, agreeing with the analytical conduction calculation. The 5 W electronics bridge reached 52.69 C with a 40 C cooled end. At 300 W with identical ideal cooling, saucepan peaks were 69.434 C with a stainless middle layer, 51.257 C with aluminium and 47.686 C with copper. Copper refinement changed the peak by 0.004 C. The report includes native temperature plots, material properties, boundary conditions, analytical checks and mesh sensitivity. Interpretation follows the documented steady-state contact and cooling assumptions. Technical report attached. Nimalann Design Services