PCB KiCAD design

• Six-layer PCB stack-up configured with dedicated power and ground planes for controlled impedance and low noise coupling. • Custom 3D component library modeled with exact mechanical dimensions matching manufacturer package specifications. • Footprint-to-model alignment validated for pad pitch, body outline, and lead geometry accuracy. • Differential and high-speed traces routed with length matching and return-path continuity considerations. • Via placement optimized for signal integrity, thermal dissipation, and ground stitching. • Copper pours and plane segmentation implemented to minimize EMI and maintain stable reference planes. • Silkscreen, solder mask, and courtyard clearances verified against fabrication tolerances. • Component placement optimized for signal flow, reduced loop area, and assembly accessibility. • STEP-compatible 3D models integrated for ECAD–MCAD interoperability and enclosure validation. • Final layout validated using DRC/ERC checks to ensure manufacturability and electrical reliability.