Nvidia Jetson Orin Nano Enclosure: Thermal Optimized & DFM Ready | Md Mamun Mia

# Thermal Optimized Enclosure for Nvidia Jetson Orin Nano ## Project Overview This project showcases the advanced **CAD design** and **DFM optimization** of a robust housing for the **Nvidia Jetson Orin Nano** module—the preferred platform for edge AI and robotics. The primary design goal was ensuring maximum thermal dissipation and component protection without obstructing crucial I/O. Leveraging my EEE background, this enclosure is engineered for optimal performance under load, making it ideal for industrial or high-demand commercial applications. ## Technical Requirements & Thermal Management The design successfully integrates complex thermal and mounting features while maintaining clean lines suitable for **Injection Molding**: - **Advanced Thermal Design:** Model includes dedicated mounting points and optimized airflow vents for both active (fan) and passive (heatsink) cooling solutions, crucial for maintaining Jetson performance. - **Precision Port Integration:** All custom cutouts for peripheral connections (USB, HDMI, Ethernet) and internal header access are modeled with precise tolerances for secure, plug-and-play access. - **Manufacturing Readiness (DFM):** The model features **2.0–2.5mm wall thickness**, screw bosses reinforced with ribs, and a **modular two-piece assembly** for easy installation and maintenance. - **Mounting Options:** Includes integrated VESA/wall mounting points suitable for industrial deployment. ## Tools & Deliverables This project demonstrates proficiency in designing for high-performance electronics manufacturing. - **Primary CAD Software:** **SolidWorks** or **Fusion 360** - **Visualization:** Photorealistic product renders from **KeyShot**. - **Deliverables:** - Fully assembled and detailed **CAD Assembly Model** (native files). - **2D Manufacturing Drawings** specifying critical dimensions and internal component clearances. - **STEP/IGES** files for rapid prototyping or tooling. This enclosure is ready to be manufactured for high-performance edge computing applications.