DESIGNING A NINTENDO 64-INSPIRED CASE

This US based project required a custom enclosure for an Orange Pi Zero 2, styled after the classic Nintendo 64 console. Wall thickness was set at 2mm to balance rigidity and print efficiency. Port cutouts were modelled with clearance tolerances accounting for typical FDM dimensional variation. Ventilation apertures were incorporated to allow passive airflow across the board without compromising the visual design. Snap fit assembly was evaluated and rejected in favour of a two part shell with mechanical fasteners to avoid snap arm fatigue over repeated assembly cycles. I designed the full enclosure in CAD with all port cutouts, internal fitment, and surface details, then delivered a complete print-ready STL file with a detailed assembly drawing. The client printed and assembled the enclosure themselves using the drawing I provided. Their feedback was that everything fit perfectly.
3d-modeilng dfm-design-for-manufacturing 3d-prinitng