COMPUTER HEAT SINK ANALYSIS

The project is to conduct a thermal study analyzing the steady-state, the transient and the thermal stress response of the heat sink by using the steady-state solution as the temperature load for the heat sink of a computer made of aluminum. A fan forces air over all surfaces of the heat sink except for the base, The surrounding air is 28°. ROLE: Thermal Analyst and Engineer TOOLS USED: i.Solidworks for modelling ii. Ansys for thermal Analysis